Materials | Standard | Advanced |
| Standard Features | Standard | Advanced |
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FR4 (130‐180 Tg by DSC) | Y | Y |
| Maximum layer count | 26 | 36 |
Halogen Free | Y | Y |
| Maximum Panel Size | 510*1100MM | 680*1100mm |
BT Epoxy | Y | Y |
| Outer Layer Trace/Spacing (1/3 oz) | 0.0035″/0.0035″[90μm/90μm] | 0.0025″/0.003″[64μm/76μm] |
Getek | Y | Y |
| Inner Layer Trace/Spacing (H oz) | 0.003″/0.003″ [76μm/76μm] | 0.002″/0.0025″ [50μm/64μm] |
Isola 370HR 406 408 IS410 IS 420 IS620 | Y | Y |
| Maximum PCB thickness | 0.125″[3.2mm] | 0.177″[4.5mm] |
Nelco 4000 | Y | Y |
| Minimum PCB thickness | 0.008″[0.20mm] | 0.004″[0.10mm] |
Rogers 4000 | Y | Y |
| Minimum mechancial drill size | 0.008″[0.20mm] | 0.004″[0.10mm] |
PTFE | Y | Y |
| Maximum PCB aspect ration | 10:01 | 12:01 |
Dupont Pyralux | N | Y |
| Maximum copper weight | 5 oz [178μm] | 6 oz [214μm] |
Aluminum Core | Y | Y |
| Minimum copper weight | 1/3 oz [12μm] | 1/4 oz [9μm] |
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| Minimum core thickness | 0.002″[50μm] | 0.0015″[38μm] |
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| Minimum dielectric thickness | 0.0025″[64μm] | 0.0015″[38μm] |
Surface Finishes |
| Minimum Pad Size over Drill | 0.018″[0.46mm] | 0.016″[0.4mm] |
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ENIG | Y | Y |
| Solder Mask Registration | +/‐ 0.002″[50μm] | +/‐ 0.0015″[38μm] |
Flash Gold | Y | Y |
| Mimimum Solder Mask Dam | 0.003″[76μm] | 0.0025″[64μm] |
Electrolytic Nickel/Hard Gold | Y | Y |
| Copper feature to PCB edge | 0.015″[0.38mm] | 0.010″[0.25mm] |
HASL | Y | Y |
| Tolerance on overall dimensions | +/‐ 0.004″[100μm] | +/‐ 0.002″[50μm] |
Lead Free HASL | Y | Y |
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Immersion Ag | Y | Y |
| HDI Features |
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Immersion Tin | Y | Y |
| Capture pad size | 0.010″[0.25mm] | 0.009″[0.22mm] |
OSP | Y | Y |
| Glass reinforced dielectrics | Y | Y |
Selective & Multiple Surface Finishes | Y | Y |
| Maximum aspect ratio | 10:1 | 12:1 |
Electrolytic Soft Gold | N | Y |
| Minimum microvia hole size | 0.2mm | 0.1mm |
Carbin Ink | Y | Y |
| Stacked Microvias | Y | Y |
Peelable Solder Mask / Kapton Tape | Y | Y |
| Copper Filled Microvias | Y | Y |
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PCB Technologies |
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Buried and Blind Microvias | Y | Y |
| Quality System and Certificates |
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Sequential lamination | Y | Y |
| IPC‐600, 6012, Class II and III |
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Mixed dielectric / Hybrid construction | Y | Y |
| ISO 9001:2008 |
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Aluminum Back PCB | Y | Y |
| TS 16949:2009 |
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Buried Capacitance | N | Y |
| UL: E363740 |
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PCB w/Cavity | N | Y |
| ISO14001:2004 |
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Conductive hole fill | Y | Y |
| Shenzhen Headquarters: |
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Non‐conductive hole fill | Y | Y |
| Room 1301, Tianyue Building, Zhongxin Road, Shajing Town, Baoan District, Shenzhen,Guangdong Province, China. 518104 |
Countersink | Y | Y |
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Depth Control Drill and Rout | Y | Y |
| Tel: 0086 0755 23729129 | Fax: 0086 0755 23729116 | www.well-wisdompcb.com |
Edge Milling | Y | Y |
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Etch Back | Y | Y |
| US Office: |
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Impedance | +/‐ 10% | +/‐ 5% |
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Scoring and PCB edge Beveling | Y | Y |
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In‐board Beveling | Y | Y |
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